Design products process flow, e.g.for winding, soldering, assembly. 设计产品生产工艺流程,例如:绕线,焊接,装配。
This article introduce the flow chart of technology and their different characteristic in the installation and wiring of electric equipment PCB mixed pin-through-hole and SMD, expound the principle and the design of technical parameters of Pin-through-hole Reflow Soldering Technology. 本文介绍了混装印制板装联技术的工艺流程和各自特点,并着重介绍了穿孔再流焊技术的原理和工艺参数设计。
The content include finding appropriate components, studying appropriate proportion and optimization flow, and preparing better performance and economical soldering flux. 研究内容包括寻找合适的钎剂组分,研究各组分合适的配比和钎剂制备的工艺流程,制备出性能优越、经济性好的软钎剂。